NC-559-ASM TPF Flux Anti-Wet No-Clean 100g Cream AMTECH Solder Paste

Feature

Description : NC-559-ASM TPF Flux Anti-Wet No-Clean 100g Cream AMTECH Solder Paste NC-559 as a le
ave-in help paste residue color is very light, there is a very high value of SIR. Recommended for B
A, CSP and other solder ball array repair and fill the ball. When using smoke less, no residue. Aff
rdable. Suitable for : North and south bridge, cards, cell phone chip, video chip BGA solder, bump
ng. Also can use off the tin, the effect is very ideal. The residue was less bright spot, less smok

Description

Description : NC-559-ASM TPF Flux Anti-Wet No-Clean 100g Cream AMTECH Solder Paste NC-559 as a leave-in help paste residue color is very light, there is a very high value of SIR. Recommended for BGA, CSP and other solder ball array repair and fill the ball. When using smoke less, no residue. Affordable. Suitable for : North and south bridge, cards, cell phone chip, video chip BGA solder, bumping. Also can use off the tin, the effect is very ideal. The residue was less bright spot, less smoke, no pungent odor, do not run the ball. Package includes : 1 x Solder paste