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Feature

Applicable IC Memory/Nand Flash: BGA153, BGA169, eMMC163, eMMC169, FBGA169/153 Chip
Chip-off/IC Tesing: Nand Flash Memory, CF card and GPS Device, Mobile eMMC eMCP Device
Mobile Data Recovery Tool: extract Contacts/Text Messages/Call logs/Camera Photos/Video/APP Data from Physical/Water Damage Android Mobile Memory Chip(NB:Chip is unencrypted)
USB3.0 Version: Connect with USB cable, easier operatation for Burn in Testing, Reading and Writing Data, Debug and Programming

Description

Note:
Contact us before purchase if you do not ensure which socket model you need[amanda(@)allsocket.com], we will verify with your cellphone model and corresponding Chip Part-number.

We are manufacturer and provide Customized Service(Burn-in Testing Socket /Adapter for Specific IC package , design PCB adapter, bulk order with customized LOGO etc.) Looking for distributor/agent, email us if you're interested.

Apply to Kingston,Samsung,Sandisk,Toshiba,Hynix,Micron,HTC,MTK,Intel Memory
Apply to Most Android Cellphone caused by accidantal physical damage, such as Cracked, Shattered, Smashed, Broken, Busted Screens
Restore personal data: contacts, messages, SMS, photos, picture, videos, app data, etc
Support LED TV / mobile repair: modify, Clone/Imaging, program chips, as well as program and test chips

Operatation Demo:
Sample Software: https://www.youtube.com/watch?v=JHdLhZ72yGI

Specifics:
Model Number: DS3000-USB3.0 eMMC/eMCP Test Socket Reader
Frame/Size limiter: 11.5x13mm is the Default Limiter
Applicable IC Dimensions: 9x11mm, 11x10mm, 11.5x13mm, 12x16mm, 12x18mm, 14x18mm, 15x15mm(Specially for BGA529)
Frequency: Low Frequency
Operation Life: 100,000(Mechanical)
Operating Temperature: -40 ~ +150 Celsius degree

Package contained:
1*DS3000-USB3.0-eMMC169/153-Socket
1*USB3.0 Cable