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Feature
PhoneFix 6 In 1 PCB Motherboard BGA Reballing Stencil Template IC Chipset For iPhone For BGA153/162/169/186/221 EMCP/EMMC Repair ToolsDesigned with ventilation hole, are provided with holes for ventilation and heat dissipation to prevent any damages
High temperature resistant and top steel BGA Reballing Stencil Template is avalible for BGA153/162/169/186/221 EMCP/EMMC
shipping weight:0.1kg
Promised shipping : shipped within 2 work days and delivered 7-15 work days( we provide the effective tracking number)
Description
VIPFIX 6 In 1 Phone Motherboard BGA Reballing Stencil Template High Precision Stencil IC Chipset for iPhone BGA153 BGA169 BGA186 BGA221 EMCP EMMC RepairProduct Introduction:
-6-IN-1 BGA Reballing Stencil Template is high quality iPhone repair tool for fix iphone motherboard BGA chip. It designed with ventilation hole, are provided with holes for ventilation and heat dissipation to prevent any damages. -The high temperature resistant and top steel BGA Reballing Stencil Template is avalible for BGA153/162/169/186/221 EMCP/EMMC.