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Feature

Good low temperature alternative to 1-part TC adhesives with inconveniently high cure temperature
Excellent 1.44 W/(mK) thermal conductivity
1-to-1 mix ratio and 4 hours pot life
Stores and ships at slightly below room temperature - no freezing or dry ice required. Very long shelf life of at least three years - even when stored at room temperature
Strong water and chemical resistance to brine, acids, bases, and aliphatic hydrocarbons

Description

The 8329TCS Slow Cure Thermal Conductive Adhesive is an electronically insulating epoxy that combines long working time and high thermal conductivity with ease of use. Used for thermal management situations requiring superior bonding strengths and good thermal transfers. For example, it is used to as a die-attach for electrical and electronics, increasing their long term reliability. It is great for heat sink bonding. It is also used as a high-powered LED adhesive that maximizes the lifetime of LEDs by dissipating their heat. It has a convenient 1-to-1 mix ratio and 4 hours pot life. Due to this long pot life, the mixed adhesive essentially behaves like a 1-part adhesive for the duration of a work shift. However, unlike 1-part adhesives, it doesnt require temperatures as high as 130C and 170 C (266F and 338F) to cure, and it will cure at a more moderate 80C (176F) in less than 1 hour. The cured adhesive bonds very well to most substrates used in electronic assemblies; and resists thermal and mechanical shocks.