When you want to find heatsink plaster, you may need to consider between many choices. Finding the best heatsink plaster is not an easy task. In this post, we create a very short list about top 9 the best heatsink plaster for you. You can check detail product features, product specifications and also our voting for each product. Let’s start with following top 9 heatsink plaster:
Reviews
1. GENNEL Series 10g Thermal Conductive Glue Silicone Plaster Viscous Adhesive Cooling Compound For LED GPU Chipset Heatsink
Feature
GENNEL Series GN-910NET: 10Gram Tube
Description
* 100% New Heatsink plaster.* Application: apply to all heatsinkf no fixed clip thermal paste. Idea for MOSFET HeatsinkVGA CARD Northbridge Southbridge Heatsink.
* Features: thermal properties, strong adhesion
* Melting capacity: 0 (200 / 24Hours)
* Evaporation: 0.001% (200 / 24Hours)
* Thermal conductivity:> 1.2W/m-K
* Thermal Impedance: <0.06
* Clotting time: 3min (25 )
* Strength of connected buildings: 25Kg
* Insulation coefficient> 5.1
* Dissipation coefficient <0.005
* Temperature resistance: 200
* Net Weight: 10g
Package Includes:
1 x Thermal Heatsink Plaster Glue.
2. Arctic Alumina Thermal Adhesive 5g
Feature
Arctic Alumina Adhesive uses a layered composite of aluminum oxide and boron nitride.Arctic Alumina Adhesive is a pure electrical insulator, neither electrically conductive nor capaciti
A set of Arctic Alumina Thermal Adhesive consists of two tubes containing a total of 5 grams
Description
Arctic Alumina Ceramic Thermal Adhesive Epoxy w/ Application Wand - 5g NEW
3. MG Chemicals 8329TCM Thermal Conductive Adhesive, Medium Cure, 14 g, 2 Dispeners
Feature
Excellent 1.36 W/(mK) thermal conductivityEasy 1:1 mix ratio
Adheres to most electronic substrates
Stores and ships at slightly below room temperature - no freezing or dry ice required. Very long shelf life of at least two years - even when stored at room temperature
Strong water and chemical resistance to brine, acids, bases, and aliphatic hydrocarbons
Description
The 8329TCM Medium Cure Thermal Conductive Adhesive is an electronically insulating epoxy that combines moderate curing rate and high thermal conductivity. Used for thermal management situations requiring superior bonding strengths and good thermal transfers. For example, it is used to as a die-attach for electrical and electronics, increasing their long term reliability. It is great for heat sink bonding. It is also used as a high-powered LED adhesive that maximizes the lifetime of LEDs by dissipating their heat.. It has a convenient 1-to-1 ratio, a workable 45 minutes pot life, and a moderate curing rate. It may achieve a minimal service cure in seven hours at room temperature. The cured adhesive bonds very well to most substrates used in electronic assemblies; and resists thermal and mechanical shocks.4. Arctic Silver 7g Premium Silver Thermal Cooling Adhesive Set (ASTA-7G)
Feature
Permanent adhesiveUse with many components
7g set
Description
The Arctic Silver Thermal Adhesive is a permanent adhesive. Components you attach with Arctic Silver Thermal Adhesive will stay attached forever5. MG Chemicals 8329TCS Thermal Conductive Adhesive, Slow Cure, 15 g, 2 Dispeners
Feature
Good low temperature alternative to 1-part TC adhesives with inconveniently high cure temperatureExcellent 1.44 W/(mK) thermal conductivity
1-to-1 mix ratio and 4 hours pot life
Stores and ships at slightly below room temperature - no freezing or dry ice required. Very long shelf life of at least three years - even when stored at room temperature
Strong water and chemical resistance to brine, acids, bases, and aliphatic hydrocarbons
Description
The 8329TCS Slow Cure Thermal Conductive Adhesive is an electronically insulating epoxy that combines long working time and high thermal conductivity with ease of use. Used for thermal management situations requiring superior bonding strengths and good thermal transfers. For example, it is used to as a die-attach for electrical and electronics, increasing their long term reliability. It is great for heat sink bonding. It is also used as a high-powered LED adhesive that maximizes the lifetime of LEDs by dissipating their heat. It has a convenient 1-to-1 mix ratio and 4 hours pot life. Due to this long pot life, the mixed adhesive essentially behaves like a 1-part adhesive for the duration of a work shift. However, unlike 1-part adhesives, it doesnt require temperatures as high as 130C and 170 C (266F and 338F) to cure, and it will cure at a more moderate 80C (176F) in less than 1 hour. The cured adhesive bonds very well to most substrates used in electronic assemblies; and resists thermal and mechanical shocks.6. (5g) Thermal Conductive Heatsink Plaster Viscous Adhesive Compound Glue For PC GPU IC
Feature
Thermal properties, strong adhesion.Melting capacity: 0 (200degree celsius/ 24Hours)
Evaporation: 0.001% (200 degree celsius/ 24Hours)
Thermal conductivity: > 1.2W/m-K Thermal
Impedance:> 0.06
Description
(5g) Thermal Conductive Heatsink Plaster Viscous Adhesive Compound Glue For PC GPU IC Works perfect to hold heatsink or cooling for laptop desktop north-bridge chips. etc7. 25Mx20mmx0.15mm Thermal Adhesive Tape,High Performance Thermally Double Side Tapes Cooling Pad Apply to Heatsink,LED,IGBT, IC Chip,Computer CPU,GPU,Modules,MOS tube,SSD Drives
Feature
Aikenuo thermal conductivity double-sided adhesive With high thermal conductivity and insulation properties and compression, adhesion,Can fill the uneven surface,Can be tightly and firmly fit the heat source devices and heat sink,Has strong adhesive strength,and thermal resistance is small,effectively replace the grease and mechanical fixation,A large number of applications in the bonding heat sink to the microprocessor and other power consumption of the semiconductor,Widely applied: high power LED,High power power supply, automotive electronic heating module, motor controller, communication equipment, power semiconductor, MOS tube, power tube, IGBT chip, high voltage, high temperature, high power welder, display, computer, Video Card RAM, DDR Memory Modules, SSD drives,solar , New energy heating power devices.
Features: With the features of high thermal conductivity, insulation, strong stickiness, softness, compression, thermal double conductive tape is great helper to solve heat dissipation for many electronics products.
Easy to use: Just stick on surface of any object and tear the blue release paper, which can be tightly and firmly conglutinate on the heat source devices and heat sink to speed the heat dissipation.
Double-sided thermal adhesive tape at low cost solve the problem of both good heat dissipation and strong stickness, while improving the work efficiency. Which make the heat sink and IC chip bonding, make high power LED and heat aluminum bonding, replaced with a screw fixed, to achieve the most effective thermal dissipation.
Description
Specification:
Dimension: 20mm x 25m (Width x Length)
Glass fiber thickness: 0.15mm
Thermal Conductivity:1.5 W/m-k
Breakdown Voltage: 5KVAC
Thermal impedance : 0.3in2/w
Initial Adhesion: 1.5kg/inch
180Adhesion power: >18 N/25mm
Applicable temperature range:-30~+150 C
Features:
Thermal conductivity and high stability, its life than the general heat double-sided stickers long,
normal temperature (30~+150 C ) can work for a minimum of 5 years.
Notes For Attention:
1.When using thermal conductive double-sided tape, keep the adhesive surface clean and dry.
2.After tearing off the heat-conductive double-sided tape to peel the paper, double-sided thermal tape is evenly pressed with your fingers (just a little strength).
3.The viscosity of the heat-conductive double-sided adhesive tape have initial viscosity and persistent viscosity, and at room temperature, it takes 72 hours
to achieve the maximum adhesive strength,
That is, at the beginning of the sticky adhesive that is the initial viscosity to 40% of its maximum viscosity, persistent stickiness is stable over time.
4.In the paste process, the appropriate heating (60 ~ 70 ), will greatly contribute to the effective increase in the area of adhesive, and as soon as possible to achieve maximum adhesion,
In the lower temperature of the winter, it's little tips that heating to increase the viscosity of the heat-conductive double-sided tape when using the thermal conductive tape.
Package included:
1 Roll Thermal Conductive Double-sided Tape
8. Phobya 2-Component Thermal Glue
Feature
2-Part Mixing SolutionMixing ratio: 4 to 1 (Black to Yellow/Transparent)
Thermal conductivity: 0.9W/mK
Surface curing at 25C: 2 hrs
Complete curing at 25C: 5-7 days
Description
Phobya's 2-component thermal glue: Fixates securely and works like a thermal compound! The possible applications for a thermal glue are diverse, it is mainly used to connect two components and ensure thermal transfer between them. This glue was designed not only to provide strong adhesive power. It will also retain it after sudden load by e.g. shearing force and keep the mostly attached cooler or heatsink in place. To keep the glue fresh and prevent curing, it is shipped in two components which have to be mixed for the glue to become active. The components should be mixed in a ratio of four to one: 4 parts of the black liquid and 1 part of the yellow-transparent liquid. The content of the syringes is exactly in this ratio! A large problem of most glues is that they are basically a thermal insulator. With this thermal glue this problem has been solved: A thermal conductivity of almost 1 W/mK is plenty for most applications. Besides all these technical aspects many practical factors were also considered: For the case of only part of the glue being needed, both syringes are shipped with sealing caps to prevent drying or curing of the glue. To achieve as thin of a layer as possible between heat source and cooler, plastic spatulas are included. Multiple? Of course, this way the first spatula doesn't have to be cleaned elaborately for the next use. Strong adhesive power and high thermal conductivity - that is the 2-component thermal glue from Phobya! Model: 31073.9. Heatsink Glue, Thermal Conductive Heatsink Plaster Viscous Adhesive Compound Glue for PC GPU IC
Feature
Strength of connected buildings: 25KgMelting capacity: 0 (200degree celsius/ 24Hours)
Evaporation: 0.001% (200 degree celsius/ 24Hours)
With excellent temperature reduction performance
Composed of micro-particles of carbon for a very high thermal conductivity.
Description
Description:Stars-922 Heatsink Plaster Thermal Conductive Glue
Thermal properties, strong adhesion.
Evaporation: 0.001% (200 degree celsius/ 24Hours)
Thermal conductivity: > 1.2W/m-K Thermal
Impedance: 5.1
Dissipation coefficient:
