Heatsink Glue, Thermal Conductive Heatsink Plaster Viscous Adhesive Compound Glue for PC GPU IC

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Feature

Strength of connected buildings: 25Kg
Melting capacity: 0 (200degree celsius/ 24Hours)
Evaporation: 0.001% (200 degree celsius/ 24Hours)
With excellent temperature reduction performance
Composed of micro-particles of carbon for a very high thermal conductivity.

Description

Description:
Stars-922 Heatsink Plaster Thermal Conductive Glue
Thermal properties, strong adhesion.
Evaporation: 0.001% (200 degree celsius/ 24Hours)
Thermal conductivity: > 1.2W/m-K Thermal
Impedance: 5.1
Dissipation coefficient:

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